Segui
Xuejun Fan
Titolo
Citata da
Citata da
Anno
A review of small heat pipes for electronics
X Chen, H Ye, X Fan, T Ren, G Zhang
Applied Thermal Engineering 96, 1-17, 2016
3112016
Mechanics of microelectronics
GQ Zhang, WD Van Driel, XJ Fan
Springer Science & Business Media, 2006
2482006
Solid state lighting reliability part 2
WD Van Driel, XJ Fan, GQ Zhang
Cham, Switzerland: Springer (2017), 527-547, 2017
2292017
Experimental investigations and model study of moisture behaviors in polymeric materials
XJ Fan, SWR Lee, Q Han
Microelectronics Reliability 49 (8), 861-871, 2009
2022009
Design and optimization of thermo-mechanical reliability in wafer level packaging
XJ Fan, B Varia, Q Han
Microelectronics Reliability 50 (4), 536-546, 2010
1472010
Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives
H Tang, LN Sacco, S Vollebregt, H Ye, X Fan, G Zhang
Journal of Materials Chemistry A 8 (47), 24943-24976, 2020
1332020
An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling
V Vasudevan, X Fan
2008 58th Electronic components and technology conference, 139-145, 2008
1332008
Moisture Sensitivity of Plastic Packages of IC Devices
XJFE Suhir
Springer, 2010
130*2010
Moisture Sensitivity of Plastic Packages of IC Devices
XJFE Suhir
Springer, 2010
130*2010
Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction
H Tang, Y Li, R Sokolovskij, L Sacco, H Zheng, H Ye, H Yu, X Fan, H Tian, ...
ACS applied materials & interfaces 11 (43), 40850-40859, 2019
1172019
Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading
XJ Fan, HB Wang, TB Lim
IEEE Transactions on Components and Packaging Technologies 24 (1), 84-91, 2001
1172001
Interfacial delamination mechanisms during soldering reflow with moisture preconditioning
X Fan, GQ Zhang, WD Van Driel, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008
1102008
PoF-simulation-assisted reliability prediction for electrolytic capacitor in LED drivers
B Sun, X Fan, C Qian, G Zhang
IEEE Transactions on Industrial Electronics 63 (11), 6726-6735, 2016
1072016
Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages
X Fan, M Pei, PK Bhatti
56th Electronic Components and Technology Conference 2006, 9 pp., 2006
972006
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds
MD Placette, X Fan, JH Zhao, D Edwards
Microelectronics Reliability 52 (7), 1401-1408, 2012
962012
Mechanics of moisture for polymers: fundamental concepts and model study
X Fan
EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008
922008
Effects of dwell time and ramp rate on lead-free solder joints in FCBGA packages
X Fan, G Rasier, VS Vasudevan
Proceedings Electronic Components and Technology, 2005. ECTC'05., 901-906, 2005
892005
A micromechanics-based vapor pressure model in electronic packages
XJ Fan, J Zhou, GQ Zhang, LJ Ernst
872005
Degradation modeling of mid-power white-light LEDs by using Wiener process
J Huang, DS Golubović, S Koh, D Yang, X Li, X Fan, GQ Zhang
Optics express 23 (15), A966-A978, 2015
822015
Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration
X Fan
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and …, 2010
802010
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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