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- Nenad MiljkovicUniversity of Illinois at Urbana-ChampaignEmail verificata su illinois.edu
- Soumyadip SettAssistant Professor, Indian Institute of Technology GandhinagarEmail verificata su iitgn.ac.in
- Xiao Yan (颜笑)Chongqing UniversityEmail verificata su cqu.edu.cn
- Moonkyung KimStaff Engineer at Samsung Electronics Device Solutions Semiconductor R&D CenterEmail verificata su illinois.edu
- Shreyas ChavanGraduate Student, University of Illinois at Urbana-ChampaignEmail verificata su illinois.edu
- Junho OhDepartment of Mechanical Engineering, Hanyang University ERICAEmail verificata su hanyang.ac.kr
- Longnan LiChangchun Institute of Optics Fine Mechanics and Physics, Chinese Academy of Sciences; UIUCEmail verificata su ciomp.ac.cn
- Daniel OrejonSenior Lecturer Chemical Engineering, Institute Multiacale Thermofluids, The University of EdinburghEmail verificata su ed.ac.uk
- Jingcheng MaIncoming Assistant Professor at the University of Notre DameEmail verificata su nd.edu
- Evelyn N WangMechanical Engineering, MITEmail verificata su mit.edu
- Yasuyuki TakataKyushu UniversityEmail verificata su mech.kyushu-u.ac.jp
- Ryan EnrightSeguente, Nokia Bell Labs, MIT, University of LimerickEmail verificata su seguente.tech
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Hyeongyun Cha
University at Buffalo, The State University of New York
Email verificata su buffalo.edu - Home page