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- Fan RenUniversity of Florida, Bell Lab, AT&TEmail verificata su che.ufl.edu
- Changzhi LiTexas Tech UniversityEmail verificata su ttu.edu
- Stephen PeartonProfessor of Materials Science and Engineering, University of FloridaEmail verificata su mse.ufl.edu
- Zhen Ning LowQualcommEmail verificata su qualcomm.com
- Tatsuo ItohProfessor of Electrical Engineering, UCLAEmail verificata su ee.ucla.edu
- Li-Chia Tien (田禮嘉)Professor, National Dong Hwa UniversityEmail verificata su mail.ndhu.edu.tw
- Brent P. GilaUniversity of FloridaEmail verificata su ufl.edu
- Travis J. AndersonNaval Research LaboratoryEmail verificata su nrl.navy.mil
- Yu-Te LiaoNational Yang Ming Chiao Tung UniversityEmail verificata su g2.nctu.edu.tw
- Byung-Hwan ChuIBM, Samsung, U or FloridaEmail verificata su ufl.edu
- Tzyy-Sheng HorngProf. of Electrical Engineering, National Sun Yat-Sen University, TaiwanEmail verificata su ee.nsysu.edu.tw
- Yves BaeyensNokia Bell-LabsEmail verificata su columbia.edu
- Lars VossLawrence Livermore National LaboratoryEmail verificata su llnl.gov
- Tien-Yu HuangQualcommEmail verificata su qti.qualcomm.com
- Yu-Lin WangNational Tsing Hua University, Institute of Nanoengineering and MicrosystemsEmail verificata su mx.nthu.edu.tw
- Jiancheng Yang. PhDKeysight TechnologiesEmail verificata su keysight.com
- Jianxuan TuEmail verificata su ufl.edu
- Ryan TsengShield AIEmail verificata su shield.ai
- Fu-Kang Wang國立中山大學電機工程學系Email verificata su student.nsysu.edu.tw
- Wayne JohnsonSoundside Partners LLCEmail verificata su soundsidepartners.com