| Fabrication factors influencing mechanical, moisture-and water-related properties of mycelium-based composites FVW Appels, S Camere, M Montalti, E Karana, KMB Jansen, ... Materials & Design 161, 64-71, 2019 | 349 | 2019 |
| Effect of processing conditions on shrinkage in injection molding KMB Jansen, DJ Van Dijk, MH Husselman Polymer Engineering & Science 38 (5), 838-846, 1998 | 258 | 1998 |
| Effect of pressure history on shrinkage and residual stresses—injection molding with constrained shrinkage KMB Jansen, G Titomanlio Polymer Engineering & Science 36 (15), 2029-2040, 1996 | 171 | 1996 |
| Droplet breakup in concentrated emulsions KMB Jansen, WGM Agterof, J Mellema Journal of rheology 45 (1), 227-236, 2001 | 146 | 2001 |
| In‐mold shrinkage and stress prediction in injection molding G Titomanlio, KMB Jansen Polymer Engineering & Science 36 (15), 2041-2049, 1996 | 129 | 1996 |
| Hydrophobin gene deletion and environmental growth conditions impact mechanical properties of mycelium by affecting the density of the material FVW Appels, J Dijksterhuis, CE Lukasiewicz, KMB Jansen, HAB Wösten, ... Scientific reports 8 (1), 4703, 2018 | 126 | 2018 |
| Construction of fast‐response heating elements for injection molding applications KMB Jansen, AAM Flaman Polymer Engineering & Science 34 (11), 894-897, 1994 | 106 | 1994 |
| As‐molded shrinkage measurements on polystyrene injection molded products KMB Jansen, R Pantani, G Titomanlio Polymer Engineering & Science 38 (2), 254-264, 1998 | 99 | 1998 |
| Heat transfer in injection moulding systems with insulation layers and heating elements KMB Jansen International Journal of heat and mass transfer 38 (2), 309-316, 1995 | 95 | 1995 |
| Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang Optical Materials 35 (3), 504-508, 2013 | 90 | 2013 |
| 4D printing of reconfigurable metamaterials and devices T van Manen, S Janbaz, KMB Jansen, AA Zadpoor Communications Materials 2 (1), 56, 2021 | 81 | 2021 |
| Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound M Sadeghinia, KMB Jansen, LJ Ernst International Journal of Adhesion and Adhesives 32, 82-88, 2012 | 78 | 2012 |
| Closed form expression for residual stresses and warpage during cure of composite laminates M Abouhamzeh, J Sinke, KMB Jansen, R Benedictus Composite Structures 133, 902-910, 2015 | 75 | 2015 |
| Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products MY Mehr, WD Van Driel, KMB Jansen, P Deeben, GQ Zhang Microelectronics Reliability 54 (1), 138-142, 2014 | 59 | 2014 |
| Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding M Akram, KMB Jansen, LJ Ernst, S Bhowmik International journal of adhesion and adhesives 31 (7), 598-604, 2011 | 56 | 2011 |
| Characterization of the viscoelastic properties of an epoxy molding compound during cure M Sadeghinia, KMB Jansen, LJ Ernst Microelectronics Reliability 52 (8), 1711-1718, 2012 | 54 | 2012 |
| Numerical modeling of warpage induced in QFN array molding process DG Yang, KMB Jansen, LJ Ernst, GQ Zhang, WD Van Driel, HJL Bressers, ... Microelectronics Reliability 47 (2-3), 310-318, 2007 | 54 | 2007 |
| Constitutive modeling of moulding compounds [electronic packaging applications] KMB Jansen, L Wang, DG Yang, C Van't Hof, LJ Ernst, HJL Bressers, ... 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 54 | 2004 |
| Correlation between chemistry of polymer building blocks and microelectronics reliability HJL Bressers, WD van Driel, KMB Jansen, LJ Ernst, GQ Zhang Microelectronics Reliability 47 (2-3), 290-294, 2007 | 51 | 2007 |
| Time-and temperature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses LJ Ernst, GQ Zhang, KMB Jansen, HJL Bressers J. Electron. Packag. 125 (4), 539-548, 2003 | 51 | 2003 |
Marian Bartekassistant professor, Delft University of Technology Email verificata su tudelft.nl
