Francesco de Paulis
Titolo
Citata da
Citata da
Anno
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz
R Rimolo-Donadio, X Gu, YH Kwark, MB Ritter, B Archambeault, ...
IEEE Transactions on Microwave Theory and Techniques 57 (8), 2072-2083, 2009
1532009
Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages
Y Zhang, J Fan, G Selli, M Cocchini, F de Paulis
IEEE Transactions on Microwave Theory and Techniques 56 (9), 2118-2128, 2008
1442008
Signal/power integrity analysis for multilayer printed circuit boards using cascaded S-parameters
F De Paulis, YJ Zhang, J Fan
IEEE transactions on electromagnetic compatibility 52 (4), 1008-1018, 2010
622010
A simple and efficient design procedure for planar electromagnetic bandgap structures on printed circuit boards
L Raimondo, F De Paulis, A Orlandi
IEEE Transactions on Electromagnetic Compatibility 53 (2), 482-490, 2010
592010
Rapid rotary scanner and portable coherent wideband Q-band transceiver for high-resolution millimeter-wave imaging applications
MT Ghasr, D Pommerenke, JT Case, A McClanahan, A Aflaki-Beni, ...
IEEE Transactions on Instrumentation and Measurement 60 (1), 186-197, 2010
542010
Compact configuration for common mode filter design based on planar electromagnetic bandgap structures
F de Paulis, L Raimondo, S Connor, B Archambeault, A Orlandi
IEEE transactions on electromagnetic compatibility 54 (3), 646-654, 2011
452011
Impact of shorting vias placement on embedded planar electromagnetic bandgap structures within multilayer printed circuit boards
F de Paulis, L Raimondo, A Orlandi
IEEE Transactions on Microwave Theory and Techniques 58 (7), 1867-1876, 2010
432010
Design of a common mode filter by using planar electromagnetic bandgap structures
F de Paulis, L Raimondo, S Connor, B Archambeault, A Orlandi
IEEE transactions on advanced packaging 33 (4), 994-1002, 2010
402010
Transient analysis of TSV equivalent circuit considering nonlinear MOS capacitance effects
S Piersanti, F de Paulis, A Orlandi, M Swaminathan, V Ricchiuti
IEEE Transactions on Electromagnetic Compatibility 57 (5), 1216-1225, 2015
362015
Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes
CD Wang, YM Yu, F de Paulis, AC Scogna, A Orlandi, YP Chiou, TL Wu
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011
352011
IR-DROP analysis and thermal assessment of planar electromagnetic bandgap structures for power integrity applications
F de Paulis, L Raimondo, A Orlandi
IEEE transactions on advanced packaging 33 (3), 617-622, 2009
352009
Design of homogeneous and composite materials from shielding effectiveness specifications
F de Paulis, MH Nisanci, A Orlandi, MY Koledintseva, JL Drewniak
IEEE transactions on electromagnetic compatibility 56 (2), 343-351, 2013
342013
Signal integrity analysis of single-ended and differential striplines in presence of EBG planar structures
F De Paulis, A Orlandi
IEEE Microwave and Wireless Components Letters 19 (9), 554-556, 2009
342009
Common mode filtering performances of planar EBG structures
F De Paulis, A Orlandi, L Raimondo, B Archambeault, S Connor
2009 IEEE International Symposium on Electromagnetic Compatibility, 86-90, 2009
302009
Near-field shielding performances of EMI noise suppression absorbers
S Piersanti, F de Paulis, A Orlandi, S Connor, Q Liu, B Archambeault, ...
IEEE Transactions on Electromagnetic Compatibility 59 (2), 654-661, 2016
282016
From Maxwell Garnett to Debye model for electromagnetic simulation of composite dielectrics—PART II: Random cylindrical inclusions
MH Nisanci, F De Paulis, MY Koledintseva, JL Drewniak, A Orlandi
IEEE transactions on electromagnetic compatibility 54 (2), 280-289, 2011
282011
From Maxwell Garnett to Debye model for electromagnetic simulation of composite dielectrics Part I: Random spherical inclusions
F De Paulis, MH Nisanci, MY Koledintseva, JL Drewniak, A Orlandi
IEEE transactions on electromagnetic compatibility 53 (4), 933-942, 2011
282011
Through silicon via (TSV) defect modeling, measurement, and analysis
DH Jung, Y Kim, JJ Kim, H Kim, S Choi, YH Song, HC Bae, KS Choi, ...
IEEE transactions on components, packaging and manufacturing technology 7 (1 …, 2016
272016
Diagnosis of multiple wiring faults using time-domain reflectometry and teaching–learning-based optimization
H Boudjefdjouf, R Mehasni, A Orlandi, H Bouchekara, F De Paulis, ...
Electromagnetics 35 (1), 10-24, 2015
232015
Fast physics-based via and trace models for signal and power integrity co-analysis
X Gu
DesignCon 2010, Santa Clara, CA, Feb., 2010
232010
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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