| Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz R Rimolo-Donadio, X Gu, YH Kwark, MB Ritter, B Archambeault, ... IEEE Transactions on Microwave Theory and Techniques 57 (8), 2072-2083, 2009 | 184 | 2009 |
| Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages Y Zhang, J Fan, G Selli, M Cocchini, F de Paulis IEEE Transactions on Microwave Theory and Techniques 56 (9), 2118-2128, 2008 | 165 | 2008 |
| Signal/power integrity analysis for multilayer printed circuit boards using cascaded S-parameters F De Paulis, YJ Zhang, J Fan IEEE Transactions on Electromagnetic Compatibility 52 (4), 1008-1018, 2010 | 78 | 2010 |
| A simple and efficient design procedure for planar electromagnetic bandgap structures on printed circuit boards L Raimondo, F De Paulis, A Orlandi IEEE Transactions on Electromagnetic Compatibility 53 (2), 482-490, 2010 | 72 | 2010 |
| Rapid rotary scanner and portable coherent wideband Q-band transceiver for high-resolution millimeter-wave imaging applications MT Ghasr, D Pommerenke, JT Case, A McClanahan, A Aflaki-Beni, ... IEEE Transactions on Instrumentation and Measurement 60 (1), 186-197, 2010 | 60 | 2010 |
| Through silicon via (TSV) defect modeling, measurement, and analysis DH Jung, Y Kim, JJ Kim, H Kim, S Choi, YH Song, HC Bae, KS Choi, ... IEEE transactions on components, packaging and manufacturing technology 7 (1 …, 2016 | 58 | 2016 |
| Compact configuration for common mode filter design based on planar electromagnetic bandgap structures F de Paulis, L Raimondo, S Connor, B Archambeault, A Orlandi IEEE Transactions on Electromagnetic Compatibility 54 (3), 646-654, 2011 | 54 | 2011 |
| Near-field shielding performances of EMI noise suppression absorbers S Piersanti, F de Paulis, A Orlandi, S Connor, Q Liu, B Archambeault, ... IEEE Transactions on Electromagnetic Compatibility 59 (2), 654-661, 2016 | 52 | 2016 |
| Impact of shorting vias placement on embedded planar electromagnetic bandgap structures within multilayer printed circuit boards F de Paulis, L Raimondo, A Orlandi IEEE transactions on microwave theory and techniques 58 (7), 1867-1876, 2010 | 48 | 2010 |
| IR-DROP analysis and thermal assessment of planar electromagnetic bandgap structures for power integrity applications F de Paulis, L Raimondo, A Orlandi IEEE transactions on advanced packaging 33 (3), 617-622, 2009 | 44 | 2009 |
| Transient analysis of TSV equivalent circuit considering nonlinear MOS capacitance effects S Piersanti, F De Paulis, A Orlandi, M Swaminathan, V Ricchiuti IEEE Transactions on Electromagnetic Compatibility 57 (5), 1216-1225, 2015 | 43 | 2015 |
| Design of homogeneous and composite materials from shielding effectiveness specifications F De Paulis, MH Nisanci, A Orlandi, MY Koledintseva, JL Drewniak IEEE Transactions on Electromagnetic Compatibility 56 (2), 343-351, 2013 | 43 | 2013 |
| Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes CD Wang, YM Yu, F de Paulis, AC Scogna, A Orlandi, YP Chiou, TL Wu IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011 | 42 | 2011 |
| Design of a common mode filter by using planar electromagnetic bandgap structures F de Paulis, L Raimondo, S Connor, B Archambeault, A Orlandi IEEE transactions on advanced packaging 33 (4), 994-1002, 2010 | 42 | 2010 |
| Compact and reliable T/R module prototype for advanced space active electronically steerable antenna in 3-D LTCC technology A Di Carlofelice, F de Paulis, A Fina, U Di Marcantonio, A Orlandi, ... IEEE Transactions on Microwave Theory and Techniques 66 (6), 2746-2756, 2018 | 39 | 2018 |
| Diagnosis of multiple wiring faults using time-domain reflectometry and teaching–learning-based optimization H Boudjefdjouf, R Mehasni, A Orlandi, H Bouchekara, F De Paulis, ... Electromagnetics 35 (1), 10-24, 2015 | 38 | 2015 |
| Signal integrity analysis of single-ended and differential striplines in presence of EBG planar structures F De Paulis, A Orlandi IEEE Microwave and Wireless Components Letters 19 (9), 554-556, 2009 | 38 | 2009 |
| Decoupling capacitors placement for a multichip PDN by a nature-inspired algorithm S Piersanti, F de Paulis, C Olivieri, A Orlandi IEEE Transactions on Electromagnetic Compatibility 60 (6), 1678-1685, 2017 | 35 | 2017 |
| From Maxwell Garnett to Debye model for electromagnetic simulation of composite dielectrics—Part II: Random cylindrical inclusions MH Nisanci, F De Paulis, MY Koledintseva, JL Drewniak, A Orlandi IEEE transactions on electromagnetic compatibility 54 (2), 280-289, 2011 | 34 | 2011 |
| From Maxwell Garnett to Debye model for electromagnetic simulation of composite dielectrics Part I: Random spherical inclusions F De Paulis, MH Nisanci, MY Koledintseva, JL Drewniak, A Orlandi IEEE transactions on electromagnetic compatibility 53 (4), 933-942, 2011 | 33 | 2011 |
Antonio OrlandiProfessor of Signal Integrity, University of L'AquilaGeverifieerd e-mailadres voor univaq.it
