| 3D chip stack technology using through-chip interconnects P Benkart, A Kaiser, A Munding, M Bschorr, HJ Pfleiderer, E Kohn, ... IEEE Design & Test of Computers 22 (6), 512-518, 2005 | 120 | 2005 |
| Elements for surface microfluidics in diamond R Müller, P Schmid, A Munding, R Gronmaier, E Kohn Diamond and related materials 13 (4-8), 780-784, 2004 | 49 | 2004 |
| Cu/Sn solid–liquid interdiffusion bonding A Munding, H Hübner, A Kaiser, S Penka, P Benkart, E Kohn Wafer Level 3-D ICs Process Technology, 1-39, 2008 | 39 | 2008 |
| Three-dimensional integration scheme with a thermal budget below 300° C P Benkart, A Munding, A Kaiser, E Kohn, A Heittmann, H Huebner, ... Sensors and Actuators A: Physical 139 (1-2), 350-355, 2007 | 24 | 2007 |
| Bi-stable micro actuator based on stress engineered nano-diamond J Kusterer, FJ Hernandez, S Haroon, P Schmid, A Munding, R Müller, ... Diamond and related materials 15 (4-8), 773-776, 2006 | 21 | 2006 |
| Concept for diamond 3-D integrated UV sensor A Kaiser, D Kueck, P Benkart, A Munding, GM Prinz, A Heittmann, ... Diamond and related materials 15 (11-12), 1967-1971, 2006 | 20 | 2006 |
| Chip-package-board reliability of System-in-Package using laminate chip embedding technology based on Cu leadframe P Fruehauf, A Munding, K Pressel, P Schwarz, M Vogt IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 13 | 2019 |
| Laminate chip embedding technology—Impact of material choice and processing for very thin die packaging A Munding, A Kessler, T Scharf, B Plikat, K Pressel 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 711-718, 2017 | 12 | 2017 |
| A compact low-cost doppler sensor MMIC in SiGe technology for the ISM band at 24 GHz P Abele, A Trasser, E Sonmez, KB Schad, A Munding, H Schumacher 34th European Microwave Conference, 2004. 2, 1037-1040, 2004 | 12 | 2004 |
| Interconnect technology for three-dimensional chip integration A Munding Cuvillier Verlag, 2007 | 11 | 2007 |
| Scaling aspects of microjoints for 3D chip interconnects A Munding, A Kaiser, P Benkart, E Kohn, A Heittmann, H Hubner, ... 2006 European Solid-State Device Research Conference, 262-265, 2006 | 10 | 2006 |
| Chip stacking technology for 3d-integration of sensor systems A Munding, A Kaiser, P Benkart, M Bschorr, A Heittmann, H Hübner, ... 13th Europ. Workshop on heterostructure technology, 2004 | 10 | 2004 |
| Eine Test-und Ansteuerschaltung für eine neuartige 3D Verbindungstechnologie M Bschorr, HJ Pfleiderer, P Benkart, A Kaiser, A Munding, E Kohn, ... Advances in Radio Science 3, 305-310, 2005 | 9 | 2005 |
| Evaluation of CVD diamond for heavy duty microwave switches E Kohn, W Menzel, FJ Hernandez-Guillen, R Muller, A Munding, ... IEEE MTT-S International Microwave Symposium Digest, 2003 3, 1625-1628, 2003 | 9 | 2003 |
| Power electronics for power cycling capability at high temperatures and high temperature swings A Hensler, J Lutz, M Thoben, W Schön, S Lutz, A Munding, J Lück Braunschweiger Hybridsymposium, 2009 | 8 | 2009 |
| Power Electronics in the Powertrain─ An Optimum of Integration F Vogel, S Lutz, A Hensler, J Lutz, M Thoben, W Schön, A Munding, ... Braunschweiger Symposium Hybridfahrzeuge und Energiemanagement 18 (19.02), 2009 | 8 | 2009 |
| Method for producing a chip assemblage A Heinrich, I Escher-Poeppel, M Gruber, A Munding, C Wille US Patent 10,014,275, 2018 | 6 | 2018 |
| Semiconductor device with combined passive device on chip back side A Munding, M Gruber US Patent 9,123,735, 2015 | 5 | 2015 |
| Semiconductor device including structure to control underfill material flow A Munding US Patent 10,325,783, 2019 | 4 | 2019 |
| Light emitting device and method for operating a plurality of light emitting arrangements A Munding US Patent 9,653,671, 2017 | 4 | 2017 |
