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- Yongfeng MeiFudan UniversityEmail verificata su fudan.edu.cn
- Paul K ChuChair Professor of Materials Engineering, City University of Hong KongEmail verificata su cityu.edu.hk
- Yang liwenFaculty of Materials and Optoelectronic Physics, Xiangtan UniversityEmail verificata su xtu.edu.cn
- Fei DingEmail verificata su umich.edu
- Yingchun ChengNanjing Tech University; University of Illinois Chicago; KAUST; Nanjing UniversityEmail verificata su njtech.edu.cn
- Esteban Bermúdez-UreñaVisiting professor, Universidad de Costa RicaEmail verificata su ucr.ac.cr
- Ricky FuPlasma Technology Limited / City University of Hong KongEmail verificata su cityu.edu.hk
- Suwit KiravittayaDepartment of Electrical Engineering, Faculty of Engineering, Chulalongkorn UniversityEmail verificata su chula.ac.th
- Tianrong ZhanEmail verificata su udel.edu
- Yajun GaoKAUSTEmail verificata su kaust.edu.sa
- Joseph WangUniversity California San DiegoEmail verificata su ucsd.edu
- Armando RastelliProfessor of Semiconductor Physics, Johannes Kepler University LinzEmail verificata su jku.at
- Xuanyong LiuProfessor of Shanghai Institute of Ceramics, Chinese Academy of SciencesEmail verificata su mail.sic.ac.cn
- Stefan M. HarazimGLOBALFOUNDRIES Dresden Module One LLC & Co KG
- Vladimir A. Bolaños QuiñonesSemiconductor Industry