Warpage and thermal characterization of fan-out wafer-level packaging JH Lau, M Li, D Tian, N Fan, E Kuah, W Kai, M Li, J Hao, YM Cheung, Z Li, ...
IEEE transactions on components, packaging and manufacturing technology 7 …, 2017
143 2017 Design, materials, process, fabrication, and reliability of fan-out wafer-level packaging JH Lau, M Li, QM Li, I Xu, T Chen, Z Li, KH Tan, QX Yong, Z Cheng, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (6 …, 2018
84 2018 Fan-out wafer-level packaging for heterogeneous integration JH Lau, M Li, ML Qingqian, T Chen, I Xu, QX Yong, Z Cheng, N Fan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018
81 2018 Optical nonlinearities of tea studied by Z-scan and four-wave mixing techniques YM Cheung, SK Gayen
JOSA B 11 (4), 636-643, 1994
74 1994 Excited-state absorption in Pr 3+: Y 3 Al 5 O 12 YM Cheung, SK Gayen
Physical Review B 49 (21), 14827, 1994
71 1994 Chip-first fan-out panel-level packaging for heterogeneous integration CT Ko, H Yang, JH Lau, M Li, M Li, C Lin, JW Lin, T Chen, I Xu, CL Chang, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018
57 2018 Two-photon excitation of the lowest 4 →4f 5d near-ultraviolet transitions in : SK Gayen, BQ Xie, YM Cheung
Physical review B 45 (1), 20, 1992
52 1992 Thermal compression bonding of semiconductor chips YM Cheung, TYP Lo, M Li, YH Mak, K San LAM
US Patent 8,967,452, 2015
49 2015 Effect of electrode pattern on the outputs of piezosensors for wire bonding process control SS Chiu, HLW Chan, SW Or, YM Cheung, PCK Liu
Materials Science and Engineering: B 99 (1-3), 121-126, 2003
38 2003 Vibration-induced die detachment system YM Cheung, MK Chow
US Patent 7,757,742, 2010
33 2010 Apparatus for semiconductor chip detachment YM Cheung, CK Liu, CH Yiu, CM Chong
US Patent 7,240,422, 2007
29 2007 Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding YH Chan, JK Kim, D Liu, PCK Liu, YM Cheung, MW Ng
IEEE transactions on advanced packaging 28 (4), 674-684, 2005
24 2005 Pick and place assembly for transporting a film of material YM Cheung, CM Chong
US Patent 7,182,118, 2007
23 2007 Reliability of fan-out wafer-level packaging with large chips and multiple re-distributed layers J Lau, M Li, L Yang, M Li, QX Yong, Z Cheng, T Chen, I Xu, N Fan, E Kuah, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1574-1582, 2018
22 2018 Piezoelectric sensor for measuring bonding parameters LW Chan-Wong, S San Chiu, SW Or, YM Cheung
US Patent 6,279,810, 2001
22 2001 A high throughput and reliable thermal compression bonding process for advanced interconnections M Li, DW Tian, YM Cheung, L Yang, JH Lau
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 603-608, 2015
21 2015 Peeling device for chip detachment YM Cheung, CM Chong, CH Yiu
US Patent App. 10/857,067, 2005
19 2005 Finite element stress analysis of thin die detachment process ACM Chong, YM Cheung
Fifth International Conference onElectronic Packaging Technology Proceedings …, 2003
19 2003 Simulation of the alignment sensitivity on the coupling efficiency of a ball-lens capped TO-can laser diode source into a single-mode fiber YM Cheung, CH Yiu
Proceedings of the 4th International Symposium on Electronic Materials and …, 2002
19 2002 Reliability of fan-out wafer-level heterogeneous integration J Lau, M Li, Y Lei, M Li, I Xu, T Chen, QX Yong, Z Cheng, W Kai, P Lo, Z Li, ...
International Symposium on Microelectronics 2018 (1), 000224-000232, 2018
18 2018