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Co-authors
Geoffrey Ye Li (李烨)Chair in Wireless Systems, Dept EEE, Imperial College LondonVerified email at imperial.ac.uk- Gang FengUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Guanding YuZhejiang UniversityVerified email at zju.edu.cn
- shengli zhangshenzhen university, university of science and technology of china, chinese university of hong kongVerified email at szu.edu.cn
- Leonard CiminiProfessor of Electrical and Computer Engineering, University of DelawareVerified email at udel.edu
- Chenzi JiangVerified email at udel.edu
- Tony Q.S. QuekFull Professor and ISTD Pillar Head, SUTDVerified email at ieee.org
- Yin Rui（殷锐）Information Science and Electrical Engineering, Zhejiang University City CollegeVerified email at zju.edu.cn
- Xiangwei ZhouAssociate Professor of Electrical and Computer Engineering, Louisiana State UniversityVerified email at lsu.edu
- Cong XiongIntel Corporation, USAVerified email at gatech.edu
- Chongtao GuoShenzhen University, Shenzhen, ChinaVerified email at szu.edu.cn
- Mugen PengBeijing University of Posts & Telecommun., IEEE Fellow, Web of Science Highly Cited ResearcherVerified email at bupt.edu.cn
- Li WangSchool of Electronic Engineering, Beijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
- Tommy SvenssonChalmers University of TechnologyVerified email at chalmers.se
- Xiang-Gen XiaDepartment of Electrical and Computer Engineering, University of Delaware, Newark, DE 19716, USAVerified email at ee.udel.edu
- Xijun WangSchool of Electronics and Information Technology, Sun Yat-sen UniversityVerified email at mail.sysu.edu.cn
- Jianhua TangShien-Ming Wu School of Intelligent Engineering, South China University of TechnologyVerified email at e.ntu.edu.sg
- Huazi ZhangUniversity of FloridaVerified email at zju.edu.cn
- Zhaoyang ZhangZhejiang UniversityVerified email at zju.edu.cn
Daquan Feng
Verified email at szu.edu.cn