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Coautori
- Bei LiuDept. Electronics Engineering, Chang Gung UniversityEmail verificata su cgu.edu.tw
- Hiroaki MisawaHokkaido UniversityEmail verificata su es.hokudai.ac.jp
- Suhendro Purbo PrakosoAdvanced Institute for Materials Research, Tohoku UniversityEmail verificata su tohoku.ac.jp
- Isaac Kuo-Kang LiuAssociate Professor (Reader) of Engineering, Warwick UniversityEmail verificata su warwick.ac.uk
- Samuel Husin Surya MandalaDepartment of Electronic Engineering, Chang Gung UniversityEmail verificata su cgu.edu.tw
- L.T. HandokoNational Research and Innovation Agency (BRIN)Email verificata su brin.go.id
- Albertus Sulaimanresearch scientistEmail verificata su lipi.go.id
- Rama Krushna MahantySOC Design engineer, Intel corporationEmail verificata su intel.com
- KH ChangChang Gung Memorial HospitalEmail verificata su cgmh.org.tw
- Vito KoEmail verificata su student.kit.edu
- Purnomo SejatiDepartment of Mechanical Engineering, Atma Jaya Catholic University of IndonesiaEmail verificata su atmajaya.ac.id
- Hariyanto Gunawanchung yuan christian universityEmail verificata su cycu.edu.tw