Willyan Hasenkamp
Willyan Hasenkamp
Professor, Unisinos
Verified email at unisinos.br
Title
Cited by
Cited by
Year
Simulation of epiretinal prostheses-Evaluation of geometrical factors affecting stimulation thresholds
H Kasi, W Hasenkamp, G Cosendai, A Bertsch, P Renaud
Journal of neuroengineering and rehabilitation 8 (1), 1-10, 2011
502011
Relaxation times of nanoscale deformations on the surface of a polymer thin film near and below the glass transition
RM Papaleo, R Leal, WH Carreira, LG Barbosa, I Bello, A Bulla
Physical Review B 74 (9), 094203, 2006
382006
Polyimide/SU-8 catheter-tip MEMS gauge pressure sensor
W Hasenkamp, D Forchelet, K Pataky, J Villard, H Van Lintel, A Bertsch, ...
Biomedical microdevices 14 (5), 819-828, 2012
362012
Polyimide/SU-8 catheter-tip MEMS gauge pressure sensor
W Hasenkamp, D Forchelet, K Pataky, J Villard, H Van Lintel, A Bertsch, ...
Biomedical microdevices 14 (5), 819-828, 2012
362012
Multiple-frequency impedance measurements in continuous flow for automated evaluation of yeast cell lysis
G Mernier, W Hasenkamp, N Piacentini, P Renaud
Sensors and Actuators B: Chemical 170, 2-6, 2012
272012
Instrumented knee prosthesis for force and kinematics measurements
A Arami, M Simoncini, O Atasoy, S Ali, W Hasenkamp, A Bertsch, ...
IEEE transactions on automation science and engineering 10 (3), 615-624, 2013
242013
Instrumented knee prosthesis for force and kinematics measurements
A Arami, M Simoncini, O Atasoy, S Ali, W Hasenkamp, A Bertsch, ...
IEEE transactions on automation science and engineering 10 (3), 615-624, 2013
242013
Instrumented prosthesis for knee implants monitoring
A Arami, M Simoncini, O Atasoy, W Hasenkamp, S Ali, A Bertsch, ...
2011 IEEE international conference on automation science and engineering …, 2011
202011
Design and test of a MEMS strain-sensing device for monitoring artificial knee implants
W Hasenkamp, N Thevenaz, J Villard, A Bertsch, A Arami, K Aminian, ...
Biomedical microdevices 15 (5), 831-839, 2013
112013
Multiple-frequency impedance measurements in continuous flow for the evaluation of electrical lysis of yeast cells
G Mernier, W Hasenkamp, N Piacentini, P Renaud
Procedia Eng 5, 37-40, 2010
92010
Electrodeposition and characterization of iridium oxide as electrode material for neural recording and stimulation
W Hasenkamp, S Musa, A Alexandru, W Eberle, C Bartic
World Congress on Medical Physics and Biomedical Engineering, September 7-12 …, 2009
72009
Silver nanoparticle conductive inks: synthesis, characterization, and fabrication of inkjet-printed flexible electrodes
IJ Fernandes, AF Aroche, A Schuck, P Lamberty, CR Peter, ...
Scientific Reports 10 (1), 1-11, 2020
52020
An analog front-end and adc integrated circuit for implantable force and orientation measurements in joint prosthesis
S Tanner, S Ali, M Banjevic, A Arami, K Aminian, W Hasenkamp, ...
International Conference on Wireless Mobile Communication and Healthcare …, 2012
52012
Relaxation of craters produced by ion bombardment on PMMA as a function of temperature
RM Papaléo, W Hasenkamp, LG Barbosa, R Leal
Nuclear Instruments and Methods in Physics Research Section B: Beam …, 2006
42006
Smart instrumentation for determination of ligament stiffness and ligament balance in total knee arthroplasty
W Hasenkamp, J Villard, JR Delaloye, A Arami, A Bertsch, BM Jolles, ...
Medical engineering & physics 36 (6), 721-725, 2014
22014
Monitoring the hemostasis process through the electrical characteristics of a graphene-based field-effect transistor
A Schuck, HE Kim, KM Jung, W Hasenkamp, YS Kim
Biosensors and Bioelectronics, 112167, 2020
12020
Flexible Micro/nanofabricated Systems for Medical Devices and Implants
WH Carreira
Verlag nicht ermittelbar, 2013
12013
Influence of ion-charge state on damage morphology of ion tracks in dark mica
M Lang, W Hasenkamp, N Ishikawa, N Medvedev, R Neumann, ...
GSI Scientific Report, 313, 2006
12006
Packaging Development of an Implantable Intracranial Pressure Catheter
JC Rosario, C Peter, JFS Inácio, MD Much, HI Boudinov, WH Carreira
2019 34th Symposium on Microelectronics Technology and Devices (SBMicro), 1-4, 2019
2019
Analysis of Ball Soldering Parameters on the Properties of a BGA Packaged Semiconductor
DG Rosa, MR Stracke, VT Padilha, C Peter, WH Carreira, CAM Moraes
Materials Research 20, 858-862, 2017
2017
The system can't perform the operation now. Try again later.
Articles 1–20