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- Shanyuan NiuNanjing UniversityEmail verificata su nju.edu.cn
- R. RAMESHUniversity of California, BerkeleyEmail verificata su berkeley.edu
- Boyang ZhaoUniversity of Southern CaliforniaEmail verificata su usc.edu
- Wolter SiemonsASMLEmail verificata su asml.com
- Huan ZhaoWigner Distinguished Staff Fellow, Oak Ridge National LaboratoryEmail verificata su ornl.gov
- Mikhail KatsElectrical and Computer Engineering, University of Wisconsin-MadisonEmail verificata su wisc.edu
- Pim Bram RossenEmail verificata su berkeley.edu
- Han WangUniversity of Hong KongEmail verificata su hku.hk
- Rehan KapadiaAssociate Professor, University of Southern CaliforniaEmail verificata su usc.edu
- Huaixun HuyanUniversity of California, IrvineEmail verificata su uci.edu
- Ajay K. YadavApplied Materials, IncEmail verificata su amat.com
- Jiang-Bin WuInstitute of Semiconductors, Chinese Academy of SciencesEmail verificata su semi.ac.cn
- Yucheng ZhouUniversity of VirginiaEmail verificata su virginia.edu
- Patrick E. HopkinsUniversity of VirginiaEmail verificata su virginia.edu
- Rafael JaramilloAssociate Professor of Materials Science and Enginering, MITEmail verificata su mit.edu
- Matthew MecklenburgUniversity of California, Los AngelesEmail verificata su ucla.edu
- Debarghya SarkarResearch Scientist, IBM ResearchEmail verificata su mgh.harvard.edu
- Jad SalmanUniversity of Wisconsin - MadisonEmail verificata su wisc.edu
- Kevin YeMassachusetts Institute of TechnologyEmail verificata su mit.edu
- Rohan MishraWashington University in St. LouisEmail verificata su wustl.edu