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- Patrick Fayelectrical engineering, University of Notre DameEmail verificata su nd.edu
- Wu Lu, ProfessorThe Ohio State UniversityEmail verificata su osu.edu
- Liang WangUniversity of Illinois at Urbana-Champaign, Texas InstrumentsEmail verificata su ti.com
- Paul BohnChemical & Biomolecular Engineering, University of Notre DameEmail verificata su nd.edu
- Mohamed ArafaSr. Principal Engineer at Intel. Adjunct Professor at ASUEmail verificata su intel.com
- John A. RogersSimpson/Querrey Professor, Northwestern UniversityEmail verificata su northwestern.edu
- Deepak SelvanathanEmail verificata su intel.com
- James KolodzeyUniversity of DelawareEmail verificata su udel.edu
- Seong Tae-YeonProfessor of Materials Science, Korea UniversityEmail verificata su korea.ac.kr
- Han-Ki KimSungkyunkwan UniversityEmail verificata su skku.edu
- Roberto Ricardo PanepucciCornell University, Cornell Nanoscale Science and Technology Facility - CNFEmail verificata su cti.gov.br
- Sookyung ChoiIntel CorporationEmail verificata su intel.com
- Khalid IsmailprofessorEmail verificata su himangel.com
- Sung Mo KangUniversity of California, Santa CruzEmail verificata su ucsc.edu
- Matt MeitlX Display CompanyEmail verificata su xdisplay.com
- Grigory SiminUniversity of South CarolinaEmail verificata su engr.sc.edu
- Bernard MeyersonIBM, 4IRAdvisors, Senzing, NextSiliconEmail verificata su us.ibm.com
- Remis GaskaUVTON, Inc.Email verificata su uvton.com
- Sean RommelProfessor, Rochester Institute of TechnologyEmail verificata su rit.edu
- Hooman MohseniNorthwestern UniversityEmail verificata su northwestern.edu