| Microstructure, tensile properties and wear resistance correlations on directionally solidified Al-Sn-(Cu; Si) alloys F Bertelli, ES Freitas, N Cheung, MA Arenas, A Conde, J de Damborenea, ... Journal of Alloys and Compounds 695, 3621-3631, 2017 | 72 | 2017 |
| Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn-(Si; Cu) alloys F Bertelli, C Brito, IL Ferreira, G Reinhart, H Nguyen-Thi, ... Materials & Design 72, 31-42, 2015 | 67 | 2015 |
| Characterization of dendritic microstructure, intermetallic phases, and hardness of directionally solidified Al-Mg and Al-Mg-Si alloys C Brito, TA Costa, TA Vida, F Bertelli, NÚ Cheung, JÚE Spinelli, A Garcia Metallurgical and Materials Transactions A 46, 3342-3355, 2015 | 65 | 2015 |
| Laser remelting of Al–1.5 wt% Fe alloy surfaces: numerical and experimental analyses F Bertelli, ES Meza, PR Goulart, N Cheung, R Riva, A Garcia Optics and Lasers in Engineering 49 (4), 490-497, 2011 | 53 | 2011 |
| Microstructural development of hypoeutectic Zn–(10–40) wt% Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness WLR Santos, C Brito, F Bertelli, JE Spinelli, A Garcia Journal of Alloys and compounds 647, 989-996, 2015 | 43 | 2015 |
| The effect of the growth rate on microsegregation: experimental investigation in hypoeutectic Al–Fe and Al–Cu alloys directionally solidified ES Meza, F Bertelli, PR Goulart, N Cheung, A Garcia Journal of Alloys and Compounds 561, 193-200, 2013 | 37 | 2013 |
| An alternative thermal approach to evaluate the wettability of solder alloys WLR Santos, BL Silva, F Bertelli, JE Spinelli, N Cheung, A Garcia Applied thermal engineering 107, 431-440, 2016 | 24 | 2016 |
| Inward solidification of cylinders: Reversal in the growth rate and microstructure evolution F Bertelli, N Cheung, A Garcia Applied thermal engineering 61 (2), 577-582, 2013 | 23 | 2013 |
| Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys BL Silva, F Bertelli, MV Canté, JE Spinelli, N Cheung, A Garcia Journal of Materials Science: Materials in Electronics 27, 1994-2003, 2016 | 22 | 2016 |
| Progression of plastic strain on heavy-haul railway rail under random pure rolling and its influence on crack initiation T Reis, E de Abreu Lima, F Bertelli, AA dos Santos Junior Advances in Engineering Software 124, 10-21, 2018 | 20 | 2018 |
| Inward and outward solidification of cylindrical castings: The role of the metal/mold heat transfer coefficient F Bertelli, C Brito, ES Meza, N Cheung, A Garcia Materials Chemistry and Physics 136 (2-3), 545-554, 2012 | 20 | 2012 |
| An artificial immune system algorithm applied to the solution of an inverse problem in unsteady inward solidification CH Silva-Santos, PR Goulart, F Bertelli, A Garcia, N Cheung Advances in Engineering Software 121, 178-187, 2018 | 16 | 2018 |
| An effective inverse heat transfer procedure based on evolutionary algorithms to determine cooling conditions of a steel continuous casting machine F Bertelli, CH Silva-Santos, DJ Bezerra, N Cheung, A Garcia Materials and Manufacturing Processes 30 (4), 414-424, 2015 | 16 | 2015 |
| The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates JP Curtulo, M Dias, F Bertelli, BL Silva, JE Spinelli, A Garcia, N Cheung Journal of manufacturing processes 48, 164-173, 2019 | 14 | 2019 |
| Numerical and experimental modelling of two-dimensional unsteady heat transfer during inward solidification of square billets F Bertelli, JD Faria, PR Goulart, C Brito, N Cheung, A Garcia Applied Thermal Engineering 96, 454-462, 2016 | 14 | 2016 |
| Cellular growth of single-phase Zn–Ag alloys unidirectionally solidified M Dias, C Brito, F Bertelli, A Garcia Materials Chemistry and Physics 143 (3), 895-899, 2014 | 14 | 2014 |
| Interconnection of thermal parameters, microstructure, macrosegregation and microhardness of unidirectionally solidified Zn-rich Zn–Ag peritectic alloys M Dias, C Brito, F Bertelli, OL Rocha, A Garcia Materials & Design 63, 848-855, 2014 | 12 | 2014 |
| Evaluation of thermophysical properties of Al–Sn–Si alloys based on computational thermodynamics and validation by numerical and experimental simulation of solidification F Bertelli, N Cheung, IL Ferreira, A Garcia The journal of chemical thermodynamics 98, 9-20, 2016 | 11 | 2016 |
| Thermal conductance at Sn-0.5 mass% Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth R Oliveira, C Cruz, A Barros, F Bertelli, JE Spinelli, A Garcia, N Cheung Journal of Thermal Analysis and Calorimetry 147 (8), 4945-4958, 2022 | 10 | 2022 |
| Modelagem numérica e análise experimental de parâmetros térmicos e microestruturais na solidificação radial de ligas binárias F Bertelli Campinas, 2012 | 8 | 2012 |
Amauri GarciaProfessor do Departamento de Engenharia de Manufatura e Materiais, Faculdade de Engenharia MecânicaEmail verificata su fem.unicamp.br
