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- Sudipta SealUniversity of Central FloridaEmail verificata su ucf.edu
- Chong AhnProfessor of Electrical Engineering, University of CincinnatiEmail verificata su ucmail.uc.edu
- Satyajit ShuklaSenior Principal Scientist, CSIR-NIIST, IndiaEmail verificata su niist.res.in
- Ehsan Yakhshi-TaftiLG Electronics USAEmail verificata su lge.com
- Xiaochen WangUniversity of Central FloridaEmail verificata su knights.ucf.edu
- Pawan PathakUniversity of Central FloridaEmail verificata su ucf.edu
- Woo Hyoung LeeDepartment of Civil, Environmental, and Construction Engineering, University of Central FloridaEmail verificata su ucf.edu
- Roxana ShabaniSenior Design Engineer at ASMLEmail verificata su asml.com
- Ghanashyam LondeIntel CorporationEmail verificata su intel.com
- Lei ZhaiUniversity of Central FloridaEmail verificata su ucf.edu
- Jin W. ChoiMichigan Technological UniversityEmail verificata su mtu.edu
- Jong-Hyun AhnYonsei UniversityEmail verificata su yonsei.ac.kr
- Alireza KarbalaeiPhD, Mechanical and Aerospace EngineeringEmail verificata su knights.ucf.edu
- Nae-Eung LeeProfessor of Materials Science and Engineering, Sungkyunkwan University, KoreaEmail verificata su skku.edu
- Shekhar BhansaliFlorida International UniversityEmail verificata su fiu.edu
- ramki kalyanaramanProfessor of Engineering, Cañada CollegeEmail verificata su smccd.edu
- Sang-Hoon BaeWashington University in Saint LouisEmail verificata su mit.edu
- Sameer DeshpandeApplied Materials IncEmail verificata su amat.com
- Amit KumarUCF, BRIDG, BSIEmail verificata su brewerscience.com
- Craig J. NealUniversity of Central FloridaEmail verificata su ucf.edu