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- Patrick ChiangProfessor of Electrical and Computer Engineering, Fudan UniversityEmail verificata su fudan.edu.cn
- Nanjian WuInstitute of SemiconductorsEmail verificata su red.semi.ac.cn
- Xi XiaoChina Inform. and Comm. Techn. Group Corporation (CICT);Peng Cheng Laboratory (PCL)Email verificata su wri.com.cn
- Binhao WangXi'an Institute of Optics and Precision Mechanics, Chinese Academy of SciencesEmail verificata su opt.ac.cn
- Shang HuHuawei TechnologiesEmail verificata su hisilicon.com
- Marco FiorentinoReasearcher, HPE LabsEmail verificata su hpe.com
- Rui BaiOregon State UniversityEmail verificata su eecs.oregonstate.edu
- LI CHENGvisionICsEmail verificata su evisionics.com
- Qiwen LiaoInstitute of Semiconductors, Chinese Academy of SciencesEmail verificata su semi.ac.cn
- Yang XuGraduate Student of Electrical Engineering, Columbia UniversityEmail verificata su columbia.edu
- Kunzhi YuvisionICsEmail verificata su tamu.edu
- Yang XuTexas Instruments; Oregon State University; Tsinghua UniversityEmail verificata su eecs.oregonstate.edu
- Samuel PalermoTexas A&M UniversityEmail verificata su ece.tamu.edu
- Hao LiNvidiaEmail verificata su nvidia.com
- Zhe XuanIntel CorporationEmail verificata su intel.com
- Woogeun RheeProfessor, Tsinghua UniversityEmail verificata su tsinghua.edu.cn
- Jiao ChengMaxim IntegratedEmail verificata su maximintegrated.com