| Method of forming through-silicon vias with stress buffer collars and resulting devices LR Arana, D Natekar, M Newman, CK Gurumurthy US Patent 7,402,515, 2008 | 366 | 2008 |
| A microfabricated suspended-tube chemical reactor for thermally efficient fuel processing LR Arana, SB Schaevitz, AJ Franz, MA Schmidt, KF Jensen Journal of Microelectromechanical Systems 12 (5), 600-612, 2003 | 219 | 2003 |
| Microelectronic package and method of cooling same LR Arana, MW Newman, JY Chang US Patent 7,592,697, 2009 | 85 | 2009 |
| Thermally efficient micromachined device LR Arana, AJ Franz, KF Jensen, SB Schaevitz, MA Schmidt US Patent 6,939,632, 2005 | 81 | 2005 |
| A thermophotovoltaic micro-generator for portable power applications OM Nielsen, LR Arana, CD Baertsch, KF Jensen, MA Schmidt TRANSDUCERS'03. 12th International Conference on Solid-State Sensors …, 2003 | 76 | 2003 |
| Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance NR Raravikar, D Suh, L Arana, JC Matayabas Jr US Patent 7,666,768, 2010 | 69 | 2010 |
| Sensitive power compensated scanning calorimeter for analysis of phase transformations in small samples AF Lopeandía, MT Clavaguera-Mora, LR Arana, KF Jensen, FJ Munoz, ... Review of scientific instruments 76 (6), 2005 | 64 | 2005 |
| Isotropic etching of silicon in fluorine gas for MEMS micromachining LR Arana, N de Mas, R Schmidt, AJ Franz, MA Schmidt, KF Jensen Journal of Micromechanics and Microengineering 17 (2), 384, 2007 | 63 | 2007 |
| A microfabricated suspended-tube chemical reactor for fuel processing LR Arana, SB Schaevitz, AJ Franz, KF Jensen, MA Schmidt Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE …, 2002 | 39 | 2002 |
| Adhesive system for supporting thin silicon wafer SN Kulkarni, LR Arana, ER Prack US Patent 7,462,551, 2008 | 36 | 2008 |
| Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion L Arana, M Newman, D Natekar US Patent 7,528,006, 2009 | 34 | 2009 |
| Transient liquid phase bonding method D Suh, L Arana, J Heck US Patent App. 11/323,548, 2007 | 28 | 2007 |
| Self-assembly of micro-and nanoparticles on internal micromachined silicon surfaces S Vengallatore, Y Peles, LR Arana, SM Spearing Sensors and Actuators A: Physical 113 (1), 124-131, 2004 | 25 | 2004 |
| Package-on-package interconnect stiffener S Ganesan, Y Kanaoka, RS Viswanath, R Swaminathan, RM Nickerson, ... US Patent 8,513,792, 2013 | 23 | 2013 |
| Clipless integrated heat spreader process and materials G Kostiew, R Bahadur, J Mellody, G Vakanas, L Arana US Patent 7,892,883, 2011 | 22 | 2011 |
| High-temperature microfluidic systems for thermally-efficient fuel processing LR Arana Massachusetts Institute of Technology, 2003 | 22 | 2003 |
| Method of supporting microelectronic wafer during backside processing L Arana, E Prack, M Newman US Patent App. 11/155,751, 2006 | 20 | 2006 |
| Microelectronic package, method of manufacturing same, and system including same LR Arana, VS Wakharkar, JC Matayabas, PA Koning, CK Koning US Patent App. 11/729,194, 2008 | 17 | 2008 |
| Microelectronic package including thermally conductive sealant between heat spreader and substrate A Gupta, LR Arana, D Song, CP Chiu, R Prasher, C Matayabas, ... US Patent App. 11/729,079, 2008 | 17 | 2008 |
| Thinning semiconductor wafers T Sterrett, L Arana, D Natekar US Patent App. 10/925,775, 2006 | 16 | 2006 |
