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Sewergin Alexander
Sewergin Alexander
Research Associate, ISEA RWTH Aachen
Verified email at isea.rwth-aachen.de - Homepage
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Year
Key components of modular propulsion systems for next generation electric vehicles
A Stippich, CH Van Der Broeck, A Sewergin, AH Wienhausen, M Neubert, ...
CPSS Transactions on Power Electronics and Applications 2 (4), 249-258, 2017
1472017
Design challenges of SiC devices for low-and medium-voltage DC-DC converters
G Engelmann, A Sewergin, M Neubert, RW De Doncker
IEEJ Journal of Industry Applications 8 (3), 505-511, 2019
632019
Modular bidirectional full-SiC DC-DC converter for automotive applications
A Sewergin, AH Wienhausen, K Oberdieck, RW De Doncker
2017 IEEE 12th International Conference on Power Electronics and Drive …, 2017
542017
Highly integrated two-phase SiC boost converter with 3D-printed fluid coolers and 3D-printed inductor bobbins
AH Wienhausen, A Sewergin, RW De Doncker
PCIM Europe 2018; International Exhibition and Conference for Power …, 2018
272018
Highly efficient power inductors for high-frequency wide-bandgap power converters
AH Wienhausen, A Sewergin, SP Engel, RW De Doncker
2017 IEEE 12th International Conference on Power Electronics and Drive …, 2017
272017
From ac to dc: Benefits in household appliances
A Stippich, A Sewergin, G Engelmann, J Gottschlich, M Neubert, ...
International ETG Congress 2017, 1-6, 2017
222017
Influence of the voltage-dependent output capacitance of SiC semiconductors on the electromagnetic interference in DC-DC converters for electric vehicles
K Oberdieck, A Sewergin, RW De Doncker
2017 International Symposium on Electromagnetic Compatibility-EMC EUROPE, 1-6, 2017
172017
Ultra-high power density full-SiC boost converter enabled by advanced 3D-printing techniques
AH Wienhausen, A Sewergin, RW De Doncker
2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 1281-1288, 2019
152019
Significance of thermal cross-coupling effects in power semiconductor modules
A Stippich, M Neubert, A Sewergin, RW De Doncker
2016 IEEE 2nd Annual Southern Power Electronics Conference (SPEC), 1-6, 2016
122016
A highly-integrated SiC power module for fast switching DC-DC converters
A Stippich, T Kamp, A Sewergin, L Fraeger, AH Wienhausen, D Bündgen, ...
2019 IEEE Energy Conversion Congress and Exposition (ECCE), 5329-5336, 2019
102019
Control hardware and suitable current sensors for fast switching sic dc-dc converters
A Sewergin, AH Wienhausen, S Blasius, RW De Doncker
PCIM Europe 2019; International Exhibition and Conference for Power …, 2019
102019
Comparison of high performance cooling concepts for SiC power modules
A Sewergin, A Stippich, AHWRW De
2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 2822-2825, 2019
82019
Electromagnetic emissions by three different concepts of bidirectional multi-phase SiC DC-DC boost converters
K Oberdieck, AH Wienhausen, A Sewergin, A Stippich, J Henn, ...
PCIM Europe 2019; International Exhibition and Conference for Power …, 2019
72019
Design of a high-frequency DC-DC converter with a custom power module and integrated cooling structures
A Stippich, L Fraeger, A Sewergin, T Kamp, RW De Doncker
PCIM Europe 2019; International Exhibition and Conference for Power …, 2019
52019
Design challenges and solutions for the practical application of SiC power modules: exemplified by an automotive dc-dc converter
A Sewergin
Dissertation, Rheinisch-Westfälische Technische Hochschule Aachen, 2021, 2021
42021
Cascaded control of high-frequency bidirectional multi-phase boost converters implemented on low-cost FPGA
A Sewergin, AH Wienhausen, CH van der Broeck, RW De Doncker
PCIM Asia 2020; International Exhibition and Conference for Power …, 2020
42020
Highly Integrated Boost Converter featuring a Power Density of 98 kW/dm3 and 56 kW/kg
AH Wienhausen, A Sewergin, RW De Doncker
PCIM Europe digital days 2020; International Exhibition and Conference for …, 2020
32020
Influence of current sensing equipment and dc-link capacitor on the performance of a low inductive sic switching cell
A Sewergin, S Delhey, D Buendgen, A Stippich, RW De Doncker
PCIM Europe digital days 2020; International Exhibition and Conference for …, 2020
32020
Highly integrated switching cell design based on copper diamond heat spreader, 3d printed heat sink and htcc logic board
A Sewergin, M Rittner, A Burghardt, K Kriegel, G Mitic, T Zetterer, T Hutsch, ...
CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020
32020
Cascode arrangement and semiconductor module
J Goeppert, K Oberdieck, M Riefer, N Davies, A Sewergin, P Mueller
US Patent App. 18/329,550, 2024
2024
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